High-Purity Xenon Difluoride XeF₂ CAS 13709-36-9, for Semiconductor Etching, Microelectronics Manufacturing, and High-End Fluorochemical Applications

1. Product Overview

Xenon Difluoride (XeF₂) is an important high-purity inorganic fluoride and specialty electronic material, featuring strong oxidizing properties and excellent fluorination capability. It serves as a critical etching material in semiconductor manufacturing.

High-purity XeF₂ offers stability at room temperature in solid form, moderate volatility, and selective fluorination characteristics, making it suitable for precision etching processes on silicon materials, silicon dioxide, metals, and dielectric layers.

Due to its ability to undergo gas-phase fluorination reactions without plasma conditions, XeF₂ holds unique advantages in MEMS fabrication, microelectronic processing, and research applications.

The Russian market primarily targets semiconductor manufacturers, electronic materials companies, MEMS fabrication enterprises, research institutions, and high-purity specialty chemical traders.

2. Specifications

Product Name: Xenon Difluoride

English Name: Xenon Difluoride

Abbreviation: XeF₂

Chemical Formula: XeF₂

CAS No.: 13709-36-9

Product Category: High-Purity Inorganic Fluoride / Electronic Material

Appearance: White Crystalline Powder

Purity: Supplied According to Customer Electronic-Grade Requirements

Packaging: High-Purity Bottles, Specialty Packaging

Storage: Store in a Dry, Cool Environment, Avoid Moisture

3. Main Application Areas

① Semiconductor Etching

XeF₂ can be used for selective etching of silicon, silicon dioxide, and metallic materials, suitable for advanced microelectronics manufacturing processes.

② MEMS Fabrication

Leveraging the isotropic etching characteristics of XeF₂, it can be used for silicon release processes and precision structure fabrication in microelectromechanical systems.

③ Microelectronics Research and Development

Used in advanced chip processes, electronic materials research, and specialty fluorination process development.

④ Specialty Fluorination Reactions

As a powerful fluorinating agent, used in research and high-end chemical synthesis.

4. Product Characteristics and Advantages

① High Selectivity Etching Performance

XeF₂ enables precise material removal, reducing the damage associated with conventional wet processing methods.

② Plasma-Free Etching Capability

Gas-phase XeF₂ can participate directly in reactions, making it suitable for specialized microfabrication processes.

③ High-Purity Electronic Material Value

High-purity XeF₂ meets the stringent impurity control requirements of the semiconductor and research sectors.

5. Distinctions from Related Products

① XeF₂ vs. C₄F₆/C₄F₈ Electronic Specialty Gases

XeF₂ is a solid fluorinated etching material primarily used for selective dry etching; C₄F₆ and C₄F₈ are plasma etching gases.

② XeF₂ vs. Fluorine Gas (F₂)

F₂ exhibits stronger fluorination capability but differs in industrial application scope; XeF₂ offers easier-to-control solid-state storage and release characteristics.

③ XeF₂ vs. Conventional Inorganic Fluorides

XeF₂ possesses a unique molecular structure and fluorination activity, primarily used in high-end electronics and research applications.

6. Russian Market Procurement Considerations

Customers typically focus on the following:

-Product Purity;

-Metal Impurities;

-Moisture Content;

-Packaging Cleanliness;

-Batch-to-Batch Consistency;

-Electronic-Grade Test Reports;

-Technical Documentation including COA, TDS, SDS.

7. Product Advantages

-High-End Electronic-Grade Inorganic Fluoride;

-Critical Etching Material for Semiconductor and MEMS Applications;

-Excellent Selective Fluorination Performance;

-Suitable for Advanced Microfabrication Technologies;

-High-Value-Added Specialty Fluorinated Material Product.

8. Packaging and Storage

Xenon Difluoride exhibits certain reactivity and shall be packaged in clean, sealed containers.

During storage, keep dry and avoid contact with moisture, organic materials, and incompatible substances.

9. Frequently Asked Questions (FAQ)

Q: Which industries are the primary users of Xenon Difluoride?

A: It is mainly used in semiconductor manufacturing, MEMS, microelectronic processing, research, and specialty fluorination reactions.

Q: Why is XeF₂ suitable for MEMS processing?

A: XeF₂ features isotropic silicon etching characteristics, enabling precision structure release and microfabrication.

Q: What is the difference between XeF₂ and C₄F₆?

A: XeF₂ is primarily used for selective gas-phase etching, while C₄F₆ is primarily used for plasma etching.

Q: What documentation is typically required for XeF₂ procurement in Russia?

A: COA, TDS, SDS, packaging information, and shipping documentation are typically required.