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JYLS-Series Perfluoropolyether Fluids for Vapor Phase Soldering (JYLS-200, 215, 230, 240, 260)
Basic Information Product Name: JYLS-Series Perfluoropolyether Fluids for Vapor Phase Soldering Chemical Formula: Perfluoropolyether (PFPE) Aliases: Vapor-phase soldering liquid, vapor phase soldering medium CAS: Not applicable HS Code: 3824.9999 Molecular Weight: Approx. 500~1000 EINECS: Not ...
Basic Information
Product Name: JYLS-Series Perfluoropolyether Fluids for Vapor Phase Soldering
Chemical Formula: Perfluoropolyether (PFPE)
Aliases: Vapor-phase soldering liquid, vapor phase soldering medium
CAS: Not applicable
HS Code: 3824.9999
Molecular Weight: Approx. 500~1000
EINECS: Not applicable
Structural Formula:
Description
JYLS-Series are high-temperature heat-transfer media specially designed for vapor-phase soldering processes in the electronics manufacturing industry, with five grades covering boiling points from 200℃ to 260℃. Colorless and odorless, non-flash-point, good thermal stability and residue-free; compatible with various electronic materials. They can also be used as reliable temperature-control liquids for air-tightness testing and thermal shock testing.
Technical Specifications
|
Test Item |
JYLS-200 |
JYLS-215 |
JYLS-230 |
JYLS-240 |
JYLS-260 |
|
Boiling Point (℃) |
200 |
215 |
230 |
240 |
260 |
|
Density (g/cm³) |
1.79 |
1.80 |
1.82 |
1.82 |
1.83 |
|
Dynamic Viscosity (cSt) |
2.5 |
3.7 |
4.3 |
5.3 |
7.1 |
|
Vapor Pressure (Pa) |
22 |
11 |
3.5 |
1.1 |
— |
|
Specific Heat (J/kg·°C) |
966 |
966 |
966 |
966 |
966 |
|
Heat of Vaporization (J/g) |
63 |
63 |
63 |
63 |
63 |
|
Thermal Conductivity (W/m·°C) |
0.065 |
0.065 |
0.065 |
0.065 |
0.055 |
|
Surface Tension (dyne/cm) |
19 |
20 |
20 |
20 |
20 |
|
Breakdown Voltage (2.54 mm, kV) |
≥40 |
≥40 |
≥40 |
≥40 |
≥40 |
|
Dielectric Constant |
2.1 |
2.1 |
2.1 |
2.1 |
2.0 |
|
Volume Resistivity (Ω·cm) |
1.0×10¹⁵ |
1.0×10¹⁵ |
1.0×10¹⁵ |
1.0×10¹⁵ |
1.0×10¹⁵ |
|
Thermal Decomposition Temperature (℃) |
>290 |
>290 |
>290 |
>290 |
>290 |
Applications
· Vapor-phase soldering processes for electronic components
· Air-tightness testing for semiconductor packaging
· Temperature-control medium for thermal-shock testing
· Thermal-shock reliability testing
Storage Conditions: Same as Product 1
Packaging: 5 kg/drum, 20 kg/drum or customised upon request
Chemical Properties
· Outstanding chemical resistance, non-corrosive
· Good high-temperature stability, leaves no residue
· No flash point for safe operation
· Non-toxic and compliant with environmental-protection requirements
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